Skip to content
Capability sheet / Fabrication

PCB Manufacturing

ECI Vision manufactures printed circuit boards across the full range of fabrication technologies, rigid multilayer, flex, and rigid-flex, from quick-turn prototypes to production runs, with electrical testing included and every board built in accordance with the relevant IPC standards.

Technologies

  • Rigid multilayer
  • Flex
  • Rigid-flex
  • HDI

IPC standards

  • IPC-2221 / 2222
  • IPC-2223
  • IPC-2226
Printed circuit board fabrication at ECI VisionFrom prototype to production, boards built to IPC standard.
Build technologies

Four fabrication classes, one supplier.

Each class built to its governing IPC standard.

L1

Rigid multilayer

IPC-2221 / 2222

Multilayer, motherboards, backplanes.

L2

Flexible & rigid-flex

IPC-2223

Flex and rigid-flex circuits.

L3

HDI & microvias

IPC-2226

Stacked, staggered, blind, buried.

L4

Prototype to production

Electrical test

Quick-turn through large runs.

Overview

Once a design is right, fabrication has to hold it. ECI Vision manufactures PCBs across the technologies real products demand: rigid multilayer boards, motherboards and backplanes, flexible and rigid-flex circuits, and high-density interconnect with microvias. We build prototypes, small runs, and large runs, and electrical test is part of the process, not an afterthought. Every board is fabricated in accordance with the applicable IPC standards, IPC-2221/2222 for rigid, IPC-2223 for flex and rigid-flex, IPC-2226 for HDI and microvias, so what arrives matches what was designed.

Specifications
Technologies
Rigid multilayer, flex, rigid-flex, HDI
Vias
microVias, stacked, staggered, blind, and buried
Standards
IPC-2221/2222, IPC-2223, IPC-2226
Volume
Prototype, small run, and large run
Included in every build

  • Rigid multilayer boards

    Multilayer, motherboards, and backplanes built to IPC-2221 / IPC-2222.

  • Flexible & rigid-flex

    Flex and rigid-flex circuits in accordance with IPC-2223.

  • HDI & microvias

    High-density interconnect with stacked, staggered, blind, and buried vias to IPC-2226.

  • Prototype to production

    Quick-turn prototypes, small runs, and large production runs.

  • Electrical test

    Electrical testing included so boards are verified before they ship.

  • IPC-compliant fabrication

    Every board built in accordance with the relevant IPC class and standard.

Fabrication flow

From files to verified boards.

  1. 1

    Design inputs

    We take in the final fabrication files and confirm the stackup, materials, and IPC class.

  2. 2

    Fabrication planning

    We plan the build for the board's technology, rigid, flex, rigid-flex, or HDI.

  3. 3

    Manufacturing

    We fabricate prototypes or production volume on the appropriate process.

  4. 4

    Electrical test

    Boards are electrically tested against the design before release.

  5. 5

    Release & support

    We release verified boards and support the transition into assembly and production.

Why ECI Vision

Built to standard, not best-effort.

Full technology range

Rigid, flex, rigid-flex, and HDI under one supplier.

Built to standard

Fabrication in accordance with the relevant IPC class, not best-effort.

Test included

Electrical test is part of the build, not an extra step.

One-stop capability

Manufacturing sits alongside our design and assembly, so the board moves without handoffs.